Title: Direct numerical simulation of turbulent flow over dimples - Code optimization for NEC SX-8 plus flow results
Authors: Breuer, Michael  
Lammers, P.
Zeiser, Thomas
Hager, Georg
Wellein, Gerhard
Language: en_US
Subject (DDC): DDC - Dewey Decimal Classification::000 Informatik, Wissen, Systeme
DDC - Dewey Decimal Classification::500 Naturwissenschaften
DDC - Dewey Decimal Classification::600 Technik
Issue Date: 2008
Publisher: Springer
Document Type: Conference Proceedings
Page Start: 303
Page End: 318
Publisher Place: Berlin
Conference: High Performance Computing in Science and Engineering 2007 
Abstract: 
The objective of the project DIMPLE is to study complex turbulent flows over a dimpled surface which is expected to lead to drag reduction compared to a smooth surface. In order to understand the physical mechanism of the flow over an arrangement of shallow dimples, CPU time-consuming direct numerical simulations were carried out using two different grid resolutions and three different configurations. As a first step within this project, the code LESOCC was evaluated and optimized for the new vector machine NEC SX-8. Classical vector systems still combine excellent performance with a well-established optimization approach. On the other hand, clusters based on commodity microprocessors offer comparable peak performance at much lower costs. In the context of the introduction of the NEC SX-8 vector computer series we compare single and parallel performance of a computational fluid dynamics application on the SX-8 and on the SGI Altix architecture demonstrating the potential of the SX-8 for teraflop computing in the area of turbulence research and flow control. Finally, results of the flow predictions over a dimpled surface are presented and compared with the reference case of plane channel flow with smooth walls. © 2008 Springer-Verlag.
Organization Units (connected with the publication): Strömungsmechanik 
URL: https://api.elsevier.com/content/abstract/scopus_id/84892220945
ISBN: 9783540747383
DOI: 10.1007/978-3-540-74739-0_21
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