| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Mueter, Ulf | - |
| dc.contributor.author | Radvan, Jens | - |
| dc.contributor.author | Richter, Stefan | - |
| dc.contributor.author | Hoffmann, Klaus Friedrich | - |
| dc.date.accessioned | 2020-04-06T15:17:27Z | - |
| dc.date.available | 2020-04-06T15:17:27Z | - |
| dc.date.issued | 2018 | - |
| dc.identifier.citation | Enthalten in: CIPS 2018: 10th International Conference on Integrated Power Electronics Systems / CIPS 10. 2018 Stuttgart. - [Frankfurt am Main] : VDE, 2018. - 2018, insges. 5 S. | - |
| dc.description.sponsorship | Leistungselektronik | - |
| dc.language.iso | eng | - |
| dc.publisher | VDE | - |
| dc.title | Simulation of the Thermal Transient Behaviour of Silicon Carbide Modules Using Liquid Convection Cooling | - |
| dc.type | Conference Object | - |
| dcterms.bibliographicCitation.originalpublisherplace | Frankfurt am Main | - |
| dc.identifier.url | http://ieeexplore.ieee.org/servlet/opac?punumber=8402817 | - |
| local.submission.type | only-metadata | - |
| dc.type.conferenceObject | Conference Paper | - |
| hsu.opac.import | opac-2018 | - |
| hsu.identifier.ppn | 1048334074 | - |
| item.grantfulltext | none | - |
| item.languageiso639-1 | en | - |
| item.fulltext_s | No Fulltext | - |
| item.openairetype | Conference Object | - |
| item.fulltext | No Fulltext | - |
| crisitem.author.dept | Leistungselektronik | - |
| crisitem.author.parentorg | Fakultät für Elektrotechnik | - |
| Appears in Collections: | 3 - Publication references (without fulltext) | |
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