Title: Simulation of the Thermal Transient Behaviour of Silicon Carbide Modules Using Liquid Convection Cooling
Authors: Mueter, Ulf
Radvan, Jens
Richter, Stefan
Hoffmann, Klaus Friedrich 
Language: eng
Issue Date: 2018
Publisher: VDE
Document Type: Conference Object
Source: Enthalten in: CIPS 2018: 10th International Conference on Integrated Power Electronics Systems / CIPS 10. 2018 Stuttgart. - [Frankfurt am Main] : VDE, 2018. - 2018, insges. 5 S.
Publisher Place: Frankfurt am Main
Organization Units (connected with the publication): Leistungselektronik 
URL: http://ieeexplore.ieee.org/servlet/opac?punumber=8402817
Appears in Collections:3 - Publication references (without fulltext)

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