Reducing EMC Problems Caused by Power Semiconductors Using an Electrically Non-Conducting Heat Sink

Fink, Stephan; Fahlbusch, Sebastian; Hoffmann, Klaus Friedrich; Dickmann, Stefan

doi:10.1109/EMCEurope.2018.8485140

Reducing EMC Problems Caused by Power Semiconductors Using an Electrically Non-Conducting Heat Sink

Publication date

2018

Document type

Conference paper

Author

Fink, Stephan

Fahlbusch, Sebastian

Hoffmann, Klaus Friedrich

Dickmann, Stefan

Organisational unit

Grundlagen der Elektrotechnik

Leistungselektronik

DOI

10.1109/EMCEurope.2018.8485140

URI

https://openhsu.ub.hsu-hh.de/handle/10.24405/4943

Publisher

IEEE

Book title

EMC Europe (2018). 2018 International Symposium on Electromagnetic Compatibility

First page

625

Last page

629

Part of the university bibliography

✅

Language

English

Cite as

Enthalten in: EMC Europe (2018). 2018 International Symposium on Electromagnetic Compatibility. - [Piscataway, NJ] : IEEE, 2018. - 1 Online-Ressource. - 2018, Seite 625-629

Version

Not applicable (or unknown)

Access right on openHSU

Metadata only access