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Simulation of the Thermal Transient Behaviour of Silicon Carbide Modules Using Liquid Convection Cooling

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cris.customurl 6001
cris.virtual.department #PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department Leistungselektronik
cris.virtual.department #PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department #PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.departmentbrowse Leistungselektronik
cris.virtual.departmentbrowse Leistungselektronik
cris.virtual.departmentbrowse Leistungselektronik
cris.virtualsource.department #PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtualsource.department #PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtualsource.department 924670c1-f42b-4008-b1c6-9d7c29bfc00b
cris.virtualsource.department #PLACEHOLDER_PARENT_METADATA_VALUE#
dc.contributor.author Mueter, Ulf
dc.contributor.author Radvan, Jens
dc.contributor.author Richter, Stefan
dc.contributor.author Hoffmann, Klaus Friedrich
dc.date.issued 2018
dc.description.version NA
dc.identifier.citation Enthalten in: CIPS 2018: 10th International Conference on Integrated Power Electronics Systems / CIPS 10. 2018 Stuttgart. - [Frankfurt am Main] : VDE, 2018. - 2018, insges. 5 S.
dc.identifier.uri https://openhsu.ub.hsu-hh.de/handle/10.24405/6001
dc.identifier.url http://ieeexplore.ieee.org/servlet/opac?punumber=8402817
dc.language.iso en
dc.publisher VDE
dc.relation.orgunit Leistungselektronik
dc.rights.accessRights metadata only access
dc.title Simulation of the Thermal Transient Behaviour of Silicon Carbide Modules Using Liquid Convection Cooling
dc.type Conference paper
dcterms.bibliographicCitation.originalpublisherplace Frankfurt am Main
dspace.entity.type Publication
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