Simulation of the Thermal Transient Behaviour of Silicon Carbide Modules Using Liquid Convection Cooling
Publication date
2018
Document type
Conference paper
Author
Organisational unit
Part of the university bibliography
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Cite as
Enthalten in: CIPS 2018: 10th International Conference on Integrated Power Electronics Systems / CIPS 10. 2018 Stuttgart. - [Frankfurt am Main] : VDE, 2018. - 2018, insges. 5 S.
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