Simulation of the Thermal Transient Behaviour of Silicon Carbide Modules Using Liquid Convection Cooling

Publication date
2018
Document type
Conference paper
Author
Mueter, Ulf
Radvan, Jens
Richter, Stefan
Organisational unit
Language
English
Cite as
Enthalten in: CIPS 2018: 10th International Conference on Integrated Power Electronics Systems / CIPS 10. 2018 Stuttgart. - [Frankfurt am Main] : VDE, 2018. - 2018, insges. 5 S.
Version
Not applicable (or unknown)
Access right on openHSU
Metadata only access